TM450 heatsink compound Thermal Grease High temperature resistance TU30g
TM450 heatsink compound Thermal Grease High temperature resistance TU30g
- Model Number:TM500Color : GreyThermal Conductivity :>1.93 NoThermal Impedance: <0.073Specific Gravity: 2.5Bleed: 0.05Thixotropic Index: 380±10Moment Beared Temperature: -50~340℃Operation Temperture: -30~300℃
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Detail
Technical Specifications
| Item | Value | Test Method |
| Thermal Conductivity | 1.0 ± 0.2 W/m·K | ASTM D5470 |
| Operating Temperature | -40°C ~ 200°C | - |
| Thermal Resistance | ≤0.15 °C·in²/W (@50psi, 0.1mm) | ASTM D5470 |
| Color | White (paste) | Visual |
| Density | 2.13 g/cm³ | ASTM D2240 |
| Volatility | 0.23% (@200°C, 24hrs) | ASTM E595 |
| Dielectric Strength | ≥5.0 kV/mm | ASTM D149 |
| Volume Resistivity | 10¹⁴ Ω·cm | ASTM D257 |
| Flammability Rating | UL94 V-0 | UL Standard |
| Net Weight | 30g (syringe packaging) | - |
| Certification | RoHS, REACH | - |
• High thermal conductivity (1.0 W/m·K) ensures efficient heat dissipation for CPUs/GPUs/LEDs.
• Wide temperature resistance (-40°C to 200°C) for extreme working environments.
• Non-corrosive & non-curing formula protects electronic components from damage.
• Easy application with syringe design, ensures uniform coating on contact surfaces.
• Electrical insulation performance prevents short circuits in electronic assemblies.
• RoHS/REACH compliant, eco-friendly and safe for industrial/consumer electronics use.
（Typical Applications）
• CPU/GPU heat sink bonding in computers and gaming devices.
• Thermal management of power transistors, voltage regulators and MOSFETs.
• Heat transfer for LED lighting modules and automotive electronics.
• Industrial control systems and communication equipment cooling.
Do you want to know more？
Please contact us through the following information！
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Tel: 00852-27108200 ext 82137 -
E-mail: sales@thermoelectronic.com -
Linkman: -
Http：http://thermoelectronic.com