TM500 heatsink compound Thermal Grease TU30g-Thermal Grease-Thermo Electronic Technology Co.,Ltd-Thermo Electronic Technology Co.,Ltd thermal grease thermal compund thermal glue adhesive thermal pad CPU cooler computer xbox cpu cooling fan cabls

TM500 heatsink compound Thermal Grease TU30g

Model Number:TM500Color : GreyThermal Conductivity :>1.93 NoThermal Impedance: <0.073Specific Gravity: 2.5Bleed: 0.05Thixotropic Index: 380±10Moment Beared Temperature: -50~340℃Operation Temperture: -30~300℃

Parameter	Value	Test Method
Model	TM500
Thermal Conductivity	1.93	ASTM D5470
Thermal Resistance	≤0.120	ASTM D5470
Color	Grey	Visual Inspection
Density	2.5	Gravimetric Method
Operating Temperature Range	-40 ~ 300	EN 344
Composition	20% Metal Oxide Compounds, Silicone Base	Material Analysis
Electrical Insulation	10kV Breakdown Voltage	Dielectric Strength Test
Viscosity (25°C)	1850	Brookfield RVF #7
Net Weight (Optional)	20/30g	Weighing Scale
Thixotropic Index	380±10	Rotational Viscometry

Product Features

1. High thermal conductivity (1.93 W/m·K) for efficient heat dissipation

2. Excellent electrical insulation to prevent short circuits

3. Wide operating temperature range for extreme environment use

4. Low thermal resistance to reduce heat loss at the interface

5. Non-curing formula for easy rework and application

Applications

• CPU/GPU cooling in computers and gaming devices

• LED lighting fixtures and power modules

• Industrial electronic components and power supplies

• Automotive electronics and motor controls

• Consumer electronics (laptops, smartphones, tablets)