Product Features

1. Ultra-high thermal conductivity (3.18 W/m·K) for rapid heat transfer

2. Gold conductive particles ensure superior heat dissipation performance

3. Syringe packaging for precise and mess-free application

4. Wide operating temperature range adapts to extreme working environments

5. Non-corrosive and non-curing formula, easy to rework and clean

6. Excellent electrical insulation to avoid short-circuit risks

Applications

• CPU, GPU and motherboard cooling in gaming PCs and workstations

• LED lighting, power supply modules and industrial electronics

• Automotive electronics, car audio and motor control systems

• Laptops, tablets and high-performance consumer electronics

• Heat sink assembly for semiconductor and communication equipment