Pure Copper Thermal Pad / Copper Shim (GPU/CPU Cooling)
Pure Copper Thermal Pad / Copper Shim (GPU/CPU Cooling)
- High precision copper thermal pad for laptop CPU0.1mm thin copper shim for GPU memoryNickel plated pure copper heat pad for M.2 SSDCustom size oxygen-free copper thermal shim OEM
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Detail
| Product Model | Pure Copper Thermal Pad / Copper Shim (GPU/CPU Cooling) |
| Material | 99.9% Pure Copper (C11000 Oxygen-Free Copper) |
| Thermal Conductivity | 401 W/(m·K) |
| Hardness | HV 80–100 (Brinell Hardness) |
| Common Sizes | 10×10×0.1mm, 20×20×0.2mm, 30×30×0.5mm, 40×40×1mm (customizable thickness/size) |
| Surface Treatment | Polishing / Nickel Plating / Anti-Oxidation Coating |
| Net Weight | 0.5–5g (per piece, varies by size) |
| Application | GPU VRAM, CPU IHS, M.2 SSD, IC Chips, Laptop Heatsink Gap Filler |
| Operating Temperature | -40°C to +150°C |
| Tolerance | ±0.01mm (thickness), ±0.1mm (size) |
1. Ultra-High Thermal Conductivity – Made of 99.9% oxygen-free copper with 401 W/(m·K) thermal conductivity, enabling instant heat transfer from high-heat components like GPU VRAM and CPU.
2. Precision Thickness & Size – Thickness tolerance of ±0.01mm perfectly fills gaps between heatsinks and electronic chips, eliminating air bubbles for optimal heat dissipation.
3. Anti-Oxidation & Durable – Nickel plating or anti-oxidation coating prevents copper corrosion, ensuring long-term performance in harsh operating environments.
4. Customizable Specifications – Supports OEM/ODM for custom sizes and thicknesses, fitting unique cooling needs of laptops, GPUs and industrial electronics.
5. Wide Application – Ideal for GPU VRAM, M.2 SSD, laptop CPU and IC chips, serving as a premium gap filler for both consumer and industrial electronic devices.
Do you want to know more？
Please contact us through the following information！
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Tel: 00852-27108200 ext 82137 -
E-mail: sales@thermoelectronic.com -
Linkman: -
Http：http://thermoelectronic.com