Intel LGA1700 CPU Anti-Bend Contact Frame 

Product Specifications

• Compatible Platform: Intel LGA1700 socket (12th/13th/14th Gen Core i3/i5/i7/i9 CPUs)

• Compatible Motherboard Chipsets: H610/B660/B760/Z690/Z790 series

• Product Dimensions: 70mm (L) × 54mm (W) × 6mm (H)

• Main Material: 6061 aluminum alloy with CNC machining & anodized sandblasting finish

• Net Weight: Main frame ≈20g; full kit ≈55g

• Color: Matte black (red/gray/blue optional)

• Included Accessories: 1 × L-shaped hex screwdriver, 4 × M3 mounting screws, 1 × thermal grease packet (1g)

• Operating Temperature: -20°C to 120°C

Compatible Scenarios

Designed for Intel LGA1700 desktop CPUs prone to warping under cooler pressure; ideal for PC enthusiasts,
overclockers, and system builders using air/water cooling solutions on ATX/mATX/ITX motherboards.

Product Features

1. Anti-Bending Protection: Evenly distributes cooler pressure to prevent CPU warping and PCB deformation, extending hardware lifespan.

2. Premium Aluminum Construction: 6061 aluminum alloy with anodized finish offers high rigidity, corrosion resistance, and heat dissipation performance.

3. Precision CNC Machining: Exact hole positioning avoids motherboard capacitors and ensures a perfect fit with LGA1700 sockets; no offset during installation.

4. Insulation Design: Adopts LOTES insulation pads to reduce motherboard pressure and signal interference.

5. Tool-Free Installation: Comes with an L-shaped screwdriver for quick assembly; compatible with stock and aftermarket CPU coolers.