| Parameter | Specification |
| Product Name | LGA1700 CPU Anti-Bending Correction Frame |
| Compatibility | Intel 12th/13th Gen Core CPUs, LGA1700 socket (H610/B660/Z690/B760/Z790 chipset) |
| Material | High-grade aluminum alloy with CNC anodized sandblasting process |
| Dimensions | 54 × 70 × 6 mm (main frame); 148 × 100 × 18 mm (package) |
| Weight | Main body: 20 g; Overall product (with accessories): 55 g |
| Surface Treatment | Anodized oxidation + sandblasting, scratch-resistant edge |
| Insulation Design | Lotes original specification insulation foot pads |
| Package Included | 1 × CPU anti-bending frame, 1 × L-shaped screwdriver, 1 × 2g thermal paste (TM500, 1.93W/m·K) |
| Installation | Tool-free quick installation with original motherboard screws |
| Color Option | Black, Silver/Gray |
| Function | Correct CPU bending, evenly distribute cooler pressure, reduce CPU overheating |