Silicon-chip thermal bonding characteristics in the heat sink2017-04-21
Silicon-chip thermal bonding characteristics in the heat sink and a microprocessor: it combines high thermal conductivity and insulating performance, is w...
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Correct installation steps of thermal Pad in electronic products2018-12-06
The thermal conductive Pad is one of the heat transfer interface materials, and has excellent thermal conductivity, good insulation, excellent fire resist...
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